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QPS

  • Meeting directives, such as ELV REACh and RoHS continues to be essential requirements. QPS delivers on all of these needs. QPS complies with the conditions set forth in the ISO 9001: 2015.

     

    QPS helps automotive engineers to specify the right products in a sustainable world. The steady evolution of the program has enabled many global OEM’s to specify ever-higher performance standards and represents:

    • Approved applicators: Applying these products to a common audited standard ensures the same coating performance throughout the applicator base.
    • High performance: Exceeding the high demands for corrosion resistance and exceptionally consistent torque and tension characteristics.
    • Global consistency: Wherever ZinKlad, DecoKlad or XMAPP standards are applied, applicators know they are using the same high-performance products.

    What do we do?

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    QPS flow chart

    We supply and develop QPS standards that meet and exceed OEM specifications. We validate applicators processes by conducting audits, carrying out inspections and testing the production output to make sure they meet pre-defined QPS standards and agreed technical requirements.

    We monitor and report results on a global scale to be able to service and continuously improve performance. 

    Why do we do what we do?

    We believe that we are able to assure a global consistent performance at a local level meeting the global OEM requirements with a select number of world class applicators.

    How do we do what we do?

    ESI Automotive has developed a unique Quality Performance System called QPS that tackles the challenges for high-performance automotive coatings. OEM’s can be confident that the same coatings and consistent performance are available worldwide.

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PCB miniaturization

PCB & Connectors

PCBs and Connectors

Circuitry is all about getting the power and control signals through. With increased power consumption and complexity, high frequency signals, and the necessity for miniaturisation, there is a requirement for high reliability circuitry which can handle these demands.

With the influx of electronics due to the move to autonomous driving and the electrification of vehicles, there is strong pressure to create high reliability circuitry which can work in harsh environments. Added to that is the need for materials which are mass production proven.  Our circuitry technology provides cleaning, plating and innerlayer bonding solutions for all types of printed circuit boards including rigid, flex and formable. Our plating knowledge has enabled gains in connector technology, plating on plastic and creating conductive surfaces on many dielectric materials.

Increased power in circuitry means dealing with thermal management concerns. An excellent solution is to build more copper into the PCB, enabling the substrate to pull away heat from the components. Our production proven technology MacuSpec VF-TH 200 will simultaneously fill vias and plate thru-holes of up to 5:1 aspect ratio, with electrolytic copper, on a wide range of structure sizes with great physical properties. Another solution is our single step thru-hole fill, MacuSpec THF 100.

Miniaturisation is becoming ever more necessary in automotive, as dimensions set for electronic components by car makers become smaller. Our expertise encompasses solutions such as via fill copper metallization MacuSpec AVF-700, which enables customers to plate a wide variety of blind micro via sizes in just one bath, without the need of flash plate and the ability to use direct metallization solutions.

Electronics features requiring high speed, low loss substrates can rely on M-Speed HF Copper Treatment for High Speed Innerlayers, a production proven surface treatment technology for innerlayer technologies. It provides low surface profiles and reliable adhesion for high frequency applications.

As the automotive landscape changes, the role of the final finish continues to provide durability and function for both PCB and connector. Our offer addresses the need for production proven solutions and reliability over the life span of the electronics. With the move to lead free we have developed and launched alternative for PCB finishes such as ORMECON CSN immersion tin and ENTEK PLUS HT OSP which adhere to automotive standards. For connectors we provide whisker mitigating solutions such as silver tin and M-Contact IN-2000 indium electrolytes. Mechanical bondable connectors can rely on AUTRONEX, a process which reduce gold consumption, increase throughput, and deliver consistent and uniform deposition rates.