In-mold electronics (IME) is an enabler for increased electronic content, reduced complexity and reduced weight in vehicles
Electronics have long been an integral part of automotive design, with today's consumers expecting increased electronic content and capability within their vehicles. This trend opposes the drive to move away from fossil fuels and towards hybrid / electric vehicles which requires a reduction in weight.
Additionally, designers are looking for more complex 3D structures to create a modern cockpit experience and sustainability requirements also mean that there is pressure to reduce design complexity to reduce yield loss. When all factors are considered together, it is clear that new technologies are required to enable the integration of more electronics into vehicles. In-mold electronics (IME) is a key part of this evolution. By integrating the electronics into plastic parts, lighter thinner parts with more complex styling can be produced.
At ESI Automotive we offer a single information point for a variety of products throughout the IME stack from high performance 3D first surface films to formable electronic inks for creating circuit conductors and insulators and component attach solutions for completing the part’s functionality.
Our superior expertise acquired through a long history of supplying films and electronic solutions into the automotive market means we can provide design support services. Our extensive knowledge of both design and process capabilities combined with our industry leading QPS systems (XMAPP) will help you get your design right first time, reducing development time and costs.
Our state-of-the-art integrated technology allows you the design freedom to create parts which seamlessly integrate electronics into 3D injection molded parts for a wide variety of automotive applications.