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Mar 5, 2021 News

How reliability expectations affect material requirements in semiconductor packages and PCBs - IPC APEX EXPO 2021

As part of North America’s largest electronics manufacturing event, IPC APEX EXPO, Lenora Clark, director in autonomous driving and safety technology at ESI Automotive, has been selected to speak at this year’s virtual technical conference on…

Mar 1, 2021 Press Release

ESI AUTOMOTIVE EXPERT TO PRESENT WHITEPAPER AT IPC APEX 2021

Waterbury, CT, USA – March 1st, 2021 - ESI Automotive, an integrated material solutions provider at the system level for current and next-generation automotive hardware, will deliver a presentation at IPC APEX 2021. The virtual event will take…

Feb 12, 2021 News

Changes in vehicles offer innovation opportunities

Dr Heather Nelson is director of displays and in-mold electronics at ESI Automotive. She sees a strong consumer demand for replacing mechanical switches with touch sensitive and fully integrated displays. In addition to the space and weight…

Feb 4, 2021 News

Vehicle interiors and human machine interfaces

Peter Warwick, Application Manager, and Jeffrey McClintock, Automotive Business Director, from the Displays and IME team at ESI Automotive, discuss the latest trends in interiors and what this means for OEMs and Tier 1s going forward. Vehicle…

Jan 13, 2021 News

Ask the expert: Miniaturization - High density design

  Miniaturization is a key global trend in the automotive industry. Here, Lenora Clark, Director, Autonomous Driving and Safety Technology at ESI Automotive, talks us through the impact it has had on recent designs and why the outlook is…

Dec 18, 2020 News

Silver service

Advances in sintering technology are key to improved inverter designs, providing OEMs with a raft of benefits ESI Automotive offers a range of products and solutions suited to the electric vehicle industry. On the one hand, the Connecticut, USA…

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Blue EV car on road

View our latest informational video

Range video

Extending the driving range of electric vehicles (EVs) remains one of the key challenges in the automotive industry. By helping to increase efficiencies in inverter technology, silver sintering reduces the power semiconductor content of inverters in EVs – without needing to increase battery size.

Nov 11, 2020 News

An introduction to Displays and In-Mold Electronics

We speak to Heather Nelson, director of Displays and In-Mold Electronics (IME) at ESI Automotive.   Displays and IME have become key components in the automotive industry, as OEMs and Tier 1s are continually looking for ways to…

Nov 4, 2020 News

Introducing our ADAS initiative to the automotive industry

Following the launch of ESI Automotive, we speak to Lenora Clark, director specializing in autonomous driving and safety technology, about new material offerings, and what this means for OEMs and/or Tier 1s. Can you summarise ESI Automotive’s…

Nov 1, 2020 News

FAQ: ensuring reliability in EV powertrains

Powertrain technologies are a crucial part of electric vehicles (EVs), helping to ensure reliability, safety, and efficiency. Here, Chris Klok, director - vehicle electrification technology at ESI Automotive, answers some key questions on EV…

Oct 27, 2020 Press Release

Introducing new electric vehicles

  Chris Klok, Director, Vehicle electrification technology, ESI Automotive As we’re entering a new decade, the EV market is growing at a rapid, yet anticipated pace. A huge area for investment, recent figures have suggested that…

Oct 16, 2020 News

Introduction to ESI Automotive

  Element Solutions Inc is a global, diversified specialty chemicals company, focused on providing innovative solutions across several large and growing end-markets that enhance the products of everyday life. MacDermid Enthone Industrial…

Oct 13, 2020 News

Presentation at EIPC Technical Snapshot Webinar

Lenora Clark, Director – Autonomous Driving and Safety Technology at ESI Automotive will present during the EIPC Technical Snapshot Webinar on October 14th, 2020. The presentation ‘An exploration of advanced semiconductor packaging’s effect on…