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  • Meeting directives, such as ELV REACh and RoHS continues to be essential requirements. QPS delivers on all of these needs. QPS complies with the conditions set forth in the ISO 9001: 2015.


    QPS helps automotive engineers to specify the right products in a sustainable world. The steady evolution of the program has enabled many global OEM’s to specify ever-higher performance standards and represents:

    • Approved applicators: Applying these products to a common audited standard ensures the same coating performance throughout the applicator base.
    • High performance: Exceeding the high demands for corrosion resistance and exceptionally consistent torque and tension characteristics.
    • Global consistency: Wherever ZinKlad, DecoKlad or XMAPP standards are applied, applicators know they are using the same high-performance products.

    What do we do?

    QPS flow chart

    We supply and develop QPS standards that meet and exceed OEM specifications. We validate applicators processes by conducting audits, carrying out inspections and testing the production output to make sure they meet pre-defined QPS standards and agreed technical requirements.

    We monitor and report results on a global scale to be able to service and continuously improve performance. 

    Why do we do what we do?

    We believe that we are able to assure a global consistent performance at a local level meeting the global OEM requirements with a select number of world class applicators.

    How do we do what we do?

    ESI Automotive has developed a unique Quality Performance System called QPS that tackles the challenges for high-performance automotive coatings. OEM’s can be confident that the same coatings and consistent performance are available worldwide.

PCB being assembled for ADAS components


Mar 5, 2021

How reliability expectations affect material requirements in semiconductor packages and PCBs - IPC APEX EXPO 2021

As part of North America’s largest electronics manufacturing event, IPC APEX EXPO, Lenora Clark, director in autonomous driving and safety technology at ESI Automotive, has been selected to speak at this year’s virtual technical conference on automotive electronic designs. 

CASE images

Increasing digitization and the rise of new technology are bringing about a period of significant change in the design and performance expectations of the automotive industry. Electronics are required for four distinct megatrends – better known as CASE trends – in the areas of Connectivity, Automation, Shared rides and Electrification, that are changing the automotive landscape. Growing requirements in high speed and frequency, increased processing power, thermal and power management mean the market is now adopting complex electronics systems, by incorporating functions originally created for other industries.


These four CASE trends will be an important discussion point at the upcoming IPC APEX EXPO, where industry experts are sharing knowledge and discussing how to meet these fast-changing needs to ultimately, create a robust vehicle. One crucial aspect for consideration is how reliability expectations affect material requirements – particularly in semiconductor packages and printed circuit boards (PCBs). OEMs are looking to ensure packages can withstand the high temperatures and vibrations associated with automotive environments – as well as provide the all-important affordable differentiation for consumers. In addition, material specifiers must explore areas of potential weakness, such as the joining materials within system builds.

So, why is material consideration key to overcoming these challenges? It is becoming increasingly clear that current materials for board level assembly in packages need to evolve to meet new requirements. Stringent testing indicates that traditional solder alloys may not be able to withstand thermal and mechanical pressure on solder joints, causing product failures. There is therefore value in exploring changes to individual components, alongside the entire build. 

PCB being assembled for ADAS components

In this session, Lenora Clark will highlight the performance limitations of traditional materials, such as SAC alloys in higher temperature applications. Lenora will also use data to explain how newer high reliability solder alloys are helping to extend product life by improving electronic reliability – even in the harshest automotive environments. She will also discuss pressure-less sintering materials, which can deliver greater thermal dissipation from the semiconductor die.

Focusing on this area in more detail, Lenora will present findings from the latest whitepaper, which was created in collaboration with MacDermid Alpha Electronics Solutions. She will talk about: ‘Addressing the changing landscape of automotive electronic designs: improving performance and robustness through proper material choice’ at the virtual IPC APEX EXPO running March 8-12, 2021.

The technical conference session seminar will take place on Wednesday, March 10, 2021 from 1:30 pm to 3:00 pm Central Time. During the seminar, there will be opportunities to ask questions live at the scheduled time, or users can watch on-demand for 90 days following the event.

Register for IPC APEX EXPO to watch Lenora’s seminar session.