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QPS

  • Meeting directives, such as ELV REACh and RoHS continues to be essential requirements. QPS delivers on all of these needs. QPS complies with the conditions set forth in the ISO 9001: 2015.

     

    QPS helps automotive engineers to specify the right products in a sustainable world. The steady evolution of the program has enabled many global OEM’s to specify ever-higher performance standards and represents:

    • Approved applicators: Applying these products to a common audited standard ensures the same coating performance throughout the applicator base.
    • High performance: Exceeding the high demands for corrosion resistance and exceptionally consistent torque and tension characteristics.
    • Global consistency: Wherever ZinKlad, DecoKlad or XMAPP standards are applied, applicators know they are using the same high-performance products.

    What do we do?

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    QPS flow chart

    We supply and develop QPS standards that meet and exceed OEM specifications. We validate applicators processes by conducting audits, carrying out inspections and testing the production output to make sure they meet pre-defined QPS standards and agreed technical requirements.

    We monitor and report results on a global scale to be able to service and continuously improve performance. 

    Why do we do what we do?

    We believe that we are able to assure a global consistent performance at a local level meeting the global OEM requirements with a select number of world class applicators.

    How do we do what we do?

    ESI Automotive has developed a unique Quality Performance System called QPS that tackles the challenges for high-performance automotive coatings. OEM’s can be confident that the same coatings and consistent performance are available worldwide.

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ADAS Miniaturization Semiconductor

News

Oct 13, 2020

Presentation at EIPC Technical Snapshot Webinar

Lenora Clark, Director – Autonomous Driving and Safety Technology at ESI Automotive will present during the EIPC Technical Snapshot Webinar on October 14th, 2020.

The presentation ‘An exploration of advanced semiconductor packaging’s effect on automotive electronic hardware design and assembly’ will discuss and review all aspects of the electronic build. Lenora will start with how increased performance influences the semiconductor packages, how that then affects design for PCB fabrication, and finally it considers the influence on materials for perfect assembly.

Lenora will also be taking part in the panel discussion following the webinar.

For more information on the Technical Snapshot Webinar and to register, click here.