Meeting directives, such as ELV REACh and RoHS continues to be essential requirements. QPS delivers on all of these needs. QPS complies with the conditions set forth in the ISO 9001: 2015.
QPS helps automotive engineers to specify the right products in a sustainable world. The steady evolution of the program has enabled many global OEM’s to specify ever-higher performance standards and represents:
- Approved applicators: Applying these products to a common audited standard ensures the same coating performance throughout the applicator base.
- High performance: Exceeding the high demands for corrosion resistance and exceptionally consistent torque and tension characteristics.
- Global consistency: Wherever ZinKlad, DecoKlad or XMAPP standards are applied, applicators know they are using the same high-performance products.
What do we do?Image
We supply and develop QPS standards that meet and exceed OEM specifications. We validate applicators processes by conducting audits, carrying out inspections and testing the production output to make sure they meet pre-defined QPS standards and agreed technical requirements.
We monitor and report results on a global scale to be able to service and continuously improve performance.
Why do we do what we do?
We believe that we are able to assure a global consistent performance at a local level meeting the global OEM requirements with a select number of world class applicators.
How do we do what we do?
ESI Automotive has developed a unique Quality Performance System called QPS that tackles the challenges for high-performance automotive coatings. OEM’s can be confident that the same coatings and consistent performance are available worldwide.
Miniaturization is the cornerstone to advancing safety and ultimately achieving autonomous vehicles
To function dependably in real-world scenarios, the amount of decisions required far exceeds any technology used today. Miniaturization of electronics, specifically the circuits and their supporting advanced packages, must be at the cutting edge of design for this level of processing.
Powered by innovation, we utilize experience with the most intricate interconnected designs to further develop solutions for current and future automotive requirements.
Do you find that your designs are requiring high density interconnections? Is this resulting in fabrication challenges or concerns for thermomechanical and electrochemical reliability? Our team of experts understands the impact your designs have on resultant performance and reliability. We consider this when creating new materials to support the entire automotive safety supply chain.
We are market leaders in microvia filling and additive PCB processing for more precise circuit definition. Our assembly offerings range the full spectrum of solder powder sizes with continued development on electrochemically resistant flux packages. Finally, we specialize in metal plating options for advanced semiconductor packing from wafer fabrication to backend attachment. Should your design take a complete departure from the conventional circuit board, our offerings of performance films and plating for molded plastics can reveal a new path.
Our wide range of chemical processes are found in all PCB manufacture and reach to the plating of alternative electronics such as connectors, substrate packages and molded plastic parts. Lessons learned from other markets are applied to achieve the revolutionary innovation required of automotive on its road to the future.
Semiconductor solutions provides the full range of materials from copper plating in wafer fabrication through multiple plating and material processes of wafer level packaging. We participate in all the levels of heterogenous packaging to address your needs. We focus on increased performance while meeting environmental, health and safety concerns.