Our circuitry division has been supporting all markets segments of the electronics industry for over 60 years
The path to advanced safety and ultimately next level autonomy is through increased processing power in your designs. Though not heavily used in automotive previously, today miniaturization and high density designs are unavoidable. We take lessons learned from other market segments such as smartphones and apply solutions to the automotive space.
We focus on improving our chemical processes for high reliability in harsh environments and critical safety features.
Specifically, our Circuitry division provides cleaning, plating and inner layer bonding solutions for all types of printed circuit boards including rigid, flex and formable. Our plating knowledge has enabled gains in high density designs and more recently the move to panel level packaging.
It is our collaborative approach to research and development through understanding the voice of customer that enables us to deliver products with improved performance and ease of use.
As a market leader in copper plating and surface finishing globally to all market segments, it is clear that ESI Automotive is a perfect choice for collaborating on your future technologies. Our technical experts understand the physical requirements needed for a successful conductive pathway on any design
The final plating step prior to assembly of a system is called a surface or final finish. As the automotive landscape changes, the role of the final finish continues to provide durability and function. We classify our functional surface finishes by performance requirements:
- Mechanical bondable